JPH0410217B2 - - Google Patents
Info
- Publication number
- JPH0410217B2 JPH0410217B2 JP57228716A JP22871682A JPH0410217B2 JP H0410217 B2 JPH0410217 B2 JP H0410217B2 JP 57228716 A JP57228716 A JP 57228716A JP 22871682 A JP22871682 A JP 22871682A JP H0410217 B2 JPH0410217 B2 JP H0410217B2
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- layer
- metal layer
- wiring metal
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22871682A JPS59121923A (ja) | 1982-12-28 | 1982-12-28 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22871682A JPS59121923A (ja) | 1982-12-28 | 1982-12-28 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59121923A JPS59121923A (ja) | 1984-07-14 |
| JPH0410217B2 true JPH0410217B2 (en]) | 1992-02-24 |
Family
ID=16880690
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22871682A Granted JPS59121923A (ja) | 1982-12-28 | 1982-12-28 | 半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59121923A (en]) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4674176A (en) * | 1985-06-24 | 1987-06-23 | The United States Of America As Represented By The United States Department Of Energy | Planarization of metal films for multilevel interconnects by pulsed laser heating |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5797647A (en) * | 1980-12-10 | 1982-06-17 | Toshiba Corp | Forming of electrode wiring in semiconductor device |
| JPS57210624A (en) * | 1981-02-09 | 1982-12-24 | Mitsubishi Electric Corp | Manufacture of semiconductor device |
-
1982
- 1982-12-28 JP JP22871682A patent/JPS59121923A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59121923A (ja) | 1984-07-14 |
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